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$ cat jobs/new-college-graduate-failure-analysis-engineer-renesaselectronics-2a54e33004ae.json

New College Graduate Failure Analysis Engineer

Renesaselectronics·Worldwide·Palm Bay, US·junior
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Renesas is one of the top global semiconductor companies in the world. We strive to develop a safer, healthier, greener, and smarter world, and our goal is to make every endpoint intelligent by offering product solutions in the automotive, industrial, infrastructure and IoT markets. Our robust product portfolio includes world leading MCUs, SoCs, analog and power products, plus Winning Combination solutions that curate these complementary products. We are a key supplier to the world’s leading manufacturers of the electronics you rely on every day; you may not see our products, but they are all around you. Renesas employs roughly 21,000 people in more than 30 countries worldwide. As a global team, our employees actively embody the Renesas Culture, our guiding principles based on five key elements: Transparent, Agile, Global, Innovative, and Entrepreneurial. Renesas believes in, and has a commitment to, diversity and inclusion, with initiatives and a leadership team dedicated to its resources and values. At Renesas, we want to build a sustainable future where technology helps make our lives easier. Join us and build your future by being part of what is next in electronics and the world. Our Failure Analysis Team is looking for an Electrical Engineering graduate to join our team as an Associate Failure Analysis Engineer in our Palm Bay, Florida office. The organization is responsible for root cause failure analysis of Renesas’ products collaborating with other teams across the world. We are seeking an enthusiastic, fast-learning individual who will collaborate closely with experienced engineers and technicians on analyzing, root causing, and reporting on a variety of semiconductor products. As a new team member with our team, you can expect to learn the basic failure analysis flows and gain experience with the use of optical and acoustic microscope, 3D x-ray tomography, photon emission and thermal microscopy, scanning electron microscopy and a variety of lab bench instr