Power Module Design Engineer (服务器电源模块工程师)

Renesas is one of the top global semiconductor companies in the world. We strive to develop a safer, healthier, greener, and smarter world, and our goal is to make every endpoint intelligent by offering product solutions in the automotive, industrial, infrastructure and IoT markets. Our robust product portfolio includes world-leading MCUs, SoCs, analog and power products, plus Winning Combination solutions that curate these complementary products. We are a key supplier to the world’s leading manufacturers of electronics you rely on every day; you may not see our products, but they are all around you. Renesas employs roughly 21,000 people in more than 30 countries worldwide. As a global team, our employees actively embody the Renesas Culture, our guiding principles based on five key elements: Transparent, Agile, Global, Innovative, and Entrepreneurial. Renesas believes in, and has a commitment to, diversity and inclusion, with initiatives and a leadership team dedicated to its resources and values. At Renesas, we want to build a sustainable future where technology helps make our lives easier. Join us and build your future by being part of what’s next in electronics and the world. Design high-current, high-density power modules for CPU/GPU/xPU core power and AI server power delivery applications. Collaborate with package engineers and IC designers to develop advanced packaging solutions that integrate ICs, inductors, and capacitors into a high-density module. Conduct PDN extraction for the module package to assess power path losses and switch-node ringing. Design inductors per module and silicon pinmap. Work with inductor vendors to bring concept designs into real products. Build and run module thermal models to ensure all components remain below maximum operating temperatures. Work with the validation team to debug power modules and perform bench characterization, including efficiency, thermal, and transient performance. Support design-for-manufacturing (DFM) and des