Principal Package Design Engineer

At Renesas Electronics, we are a global leader in microcontrollers, analog, power, and SoC products, delivering trusted embedded design innovation that shapes the way we live, work, and connect. As a cornerstone of our Semiconductor Power Product Group, our packaging technology is where cutting-edge silicon meets real-world application. As the industry pivots toward AI/ML hardware, high-performance computing, automotive innovation, and advanced power architectures (including SiC and GaN), semiconductor packaging has evolved from a protective enclosure into a primary driver of system performance. Joining Renesas means you will be at the forefront of this evolution, designing the advanced packaging solutions that empower the next generation of global technology. We are seeking a Senior Advanced Packaging Engineer to lead the development and integration of next-generation packaging solutions for high-performance semiconductors and electronic products. This role will focus on advanced package architectures, assembly processes, thermal and mechanical reliability, and cross-functional collaboration with design, manufacturing, suppliers, and quality teams. The ideal candidate has deep expertise in semiconductor packaging technologies and a strong track record of bringing complex products from concept through qualification and high-volume production. Responsibilities Lead the design, development, and qualification of advanced semiconductor packaging solutions, including: Flip-chip, Chip Embedding Wafer-level packaging (WLP/FOWLP) Panel-level packaging (laminate, molding) 2.5D/3D packaging System-in-package (SiP) Ball grid array (BGA/CSP) Define package architecture based on electrical, thermal, mechanical, reliability, and cost requirements. Drive package technology selection and development for new product introductions. Work closely with IC design, substrate, board, thermal, reliability, and manufacturing teams to ensure package compatibility and performance. Oversee pack