Process Engineering Director

We are seeking an experienced and strategic Director of Semiconductor IC Packaging Assembly Operations to lead high-volume semiconductor assembly operations for advanced packaging technologies. This role is accountable for converting qualified package technologies and NPI programs into predictable, scalable manufacturing execution that achieves production output, customer commit dates, and revenue targets. The scope includes AI/data center infrastructure power packaging applications, especially Smart Power Stages, Vertical Power Stages, Power Modules, and Discrete FET packages, with additional scope spanning wide-bandgap (WBG) technologies including SiC and GaN, DBC and AMB substrates, and advanced interconnect technologies. This leader will oversee assembly line readiness, manufacturing execution, capacity utilization, cycle time, yield performance, quality control, process change management, and ramp readiness while partnering closely with Package Engineering, Product Engineering, Quality, Supply Chain Management, Planning, Procurement, and external OSAT partners. The ideal candidate combines deep semiconductor assembly operations expertise with strong manufacturing leadership, data-driven execution, and cross-functional collaboration skills to drive factory performance, product quality, delivery reliability, and continuous improvement across global operations. This role also serves as a critical interface to Package Engineering and Supply Chain Management by ensuring package development intent, qualification requirements, equipment capacity plans, material readiness, bill of material readiness, and production ramp requirements are translated into stable, cost-competitive, high-volume assembly output. Key Responsibilities: Semiconductor Assembly Operations Leadership Lead semiconductor package assembly operations across global product lines and manufacturing partners. Drive daily, weekly, and quarterly execution to achieve production output, customer delivery comm