Senior Engineer, Process Engineering (Advanced Packaging)

Step into a career with ASM, where cutting edge technology meets collaborative culture. ​ For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving. But we’re more than just a tech company. We value diversity, inclusion and sustainability as we strive to make a positive impact on the world. Our development programs help support your growth, shaping your future and pushing the boundaries of innovation to unleash potential. Job's Mission As a Senior Engineer, Process Engineering , you will drive the development, qualification, and customer adoption of advanced thin film deposition solutions for semiconductor packaging applications. This role serves as the technical bridge between customers, R&D, hardware engineering, and product management to accelerate technology penetration and enable future business growth. What You Will Be Working On • Lead hardware and process qualification of thin film deposition equipment at customer sites. • Develop and optimize plasma etching, cleaning, and thin film deposition processes for advanced semiconductor packaging applications. • Execute customer demonstrations, process evaluations, and troubleshooting activities based on customer high-value problems (HVPs). • Collaborate closely with customers across Asia to understand technical challenges, identify new opportunities, and drive product adoption. • Partner with R&D, hardware engineering, and Global Product Management (GPM) teams to convert customer requirements into product enhancements and future BU projects. • Support customer escalations and work cross-functionally to deliver sustainable solutions. What We Are Looking For • Master’s degree or above in Materials Science, Physics, Chemical Engineering, or a related field.