Sr Staff Process Engineer

Qualify, Assembly Sustenance and Process Improvements on Power QFN package and Cu Clip related thin die assembly processes. Key Responsibilities Design package, develop processes to qualify PQFN (Power Quad Flat-No lead) packages for SPS (Smart Power Stage) products & its associated modules. Ramp up manufacturing volume and qualify required sources. Responsible for line sustaining. Improve assembly yield, capacity, quality and costs. Address internal and external customer feedback / issues collaborating with Test / Product Engineers, Quality & Operations organization. Manage Product Lifecycle Management documents to the latest status. Conduct change-management with suppliers to sustain / improve capacity and cost. Partner with Quality and Reliability teams to meet internal, industry, and customer standards. Serve as the key manufacturing engineering interface for NPI-to-production transfers Manage OSAT and contract manufacturing relationships supporting production Degree in Mechanical, Material, Physics, Chemistry or Applied Sciences. Experienced in process engineering or package development of material/process/design of thin wafer handling and SPS solder attach processes. Knowledge in quality / reliability requirements of PQFNs/QFNs/WLCSP and leaded packages. Knowledge of SPC and statistical analysis software (such as JMP). Strong interpersonal and communication skills in English. Strong analytical, written communication and presentation skills. Able to manage large projects effectively. Following merits will be assessed in interviews: i) High sense of responsibility (ii) Able to work with people of all levels (iii) Able to work with minimal supervision (iv) Self-motivated and Self-disciplined. Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier . With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, In