Staff Package Design Engineer

Job Summary • Design and develop package and interconnect methods for Renesas’s packaging needs in the areas of Power SiP/modules, wafer level, flip-chip, multi-chip module and power device packaging. GaN related PKG is a plus. • Package technologies qualification for consumer & industrial power as well as automotive power applications. Key Responsibilities • Benchmark, select and qualify suitable materials, processes and assembly subcontractors (OSAT) or contract manufacturers (CM). • Work with OSAT/CM to develop, run DOE to optimize processes, establish process spec & monitor and resolve process issues early in the production to ensure only parts with superior quality shipped to customer. • Work with Product groups and Reliability team, qualify new packages and processes within required time frame & further address internal and external customer complains working with peers of Marketing, Product groups, Quality and Operations organization to satisfy growth in businesses. • Ensure smooth transition into production & implement ramp up monitor. • Participate in packaging roadmap development & focus on execution, develop and maintain technical expertise on advances and innovations in power SiP/modules, wafer level packaging, flip chip interconnects and panel level package. • Establish & maintain package design rules. • Doctorate/Masters / Bachelor’s degree in Physics, Chemistry, Mechanical, Electrical or Materials Engineering. • >6 years of relevant experience in package development emphasizing power SiP/module, wafer level & flip-chip packaging. • Strong understanding of power SiP/modules, wafer level/flip-chip packaging methods, assembly process knowledge, qualification methods, SPC and statistical analysis software. • Strong interpersonal and communication skills. • Strong analytical and presentation skills. • Knowledge of wire-bonding & multi-chip module technologies is a plus. Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make O