【Takasaki/Toyosu】Principle Package Engineer

1. Package Development & NPI Support - Support package development activities for new Power MOSFET products including: TOLL / TOLG / TOLT Bottom-side cooled (BSC) Dual-side cooled (DSC) Top-side cooled (TSC) . Advanced lead frame and clip-bond packages - Define package requirements and specifications for new product development. - Support package qualification and AEC-Q101 compliance activities. - Drive package-related activities during NPI and product transition. 2. Thermal & Mechanical Engineering - Perform thermal analysis and package characterization. - Conduct thermal resistance and thermal impedance measurements. - Evaluate package reliability associated with: Power cycling Thermal cycling Solder joint reliability Mechanical stress - Support package-level failure analysis and root cause investigation. 3. Package Benchmarking & Technology Survey - Benchmark competitor power package technologies. - Analyze package construction, materials, and performance. - Identify technology trends and recommend future package roadmaps. - Conduct package reverse engineering and technical assessments. 4. Simulation & Modeling - Develop and maintain thermal simulation models. - Support electrical and mechanical package simulations. - Correlate simulation results with measurement data. - Collaborate with system engineers on thermal optimization and system-level performance evaluation. 5. Product & Customer Support - Support customer inquiries regarding: Thermal performance Package selection Reliability considerations - Work with Application Engineering teams on customer design support. - Develop package-related technical documentation and application notes. 6. Cross-Functional Collaboration - Coordinate package activities with: Design Engineering Product Engineering Reliability Engineering Manufacturing Marketing External package suppliers - Participate in product definition reviews and technical decision-making. 【MUST】 Thermal characterization and analysis Semiconductor package