Thermal /Mechanical Hybrid Engineer

About Etched Etched is building hardware for frontier intelligence. We co-design chips, racks, software, and manufacturing to deliver best-in-class throughput and latency across both prefill and decode workloads. Our first products are heavily focused on inference. Backed by hundreds of millions from top-tier investors and staffed by leading engineers, Etched is redefining the infrastructure layer for the fastest growing industry in history. Job Summary We are seeking a highly experienced Thermal/Mechanical Engineer who has experience designing direct-to-chip cold plate modules to join our team and lead our efforts in optimizing thermal management for high-performance systems. You must be familiar with both the thermal and mechanical aspects of the cold plate module as well as their adjacent components such as thermal interface material (TIM). You will play a crucial role in developing and implementing advanced thermal management solutions for our high-performance data center products. Your expertise in water cooling, thermal simulations, mechanical engineering and cooling system design will be essential in ensuring optimal thermal performance and reliability. Key responsibilities - Lead the in-house design and optimization of various direct-to-chip cold plate modules - Lead the design and optimization of thermal management systems for high-performance data center products, focusing on water cooling solutions and advanced cooling concepts. - Cover both the thermal and mechanical engineering design - Be very familiar with the key components of a cold plate, including but not limited to pedestals, nozzles, pedestals, internal fin designs (e.g. skived fins), etc. - Develop and implement water cooling solutions, including internal manifolds, quick disconnects, CDUs (Coolant Distribution Units), and heat exchangers. Ensure effective cooling and thermal management for high-power processors and other critical components - Candidate must be able to run liquid thermal simula